Core Technology and Application
Defu Technology
The purpose of customized design is to combine low roughness and sufficient peel strength
into the development trend of lightweight PCB boards and the low transmission loss
characteristics of high-frequency high-speed lines. High polymer additives have been developed
to achieve the goal of customized design for copper foil surface copper nodules. This
technology also takes into account low roughness and sufficient peel strength, becoming the
key to copper foil manufacturing technology.
There are factors in the metal barrier layer of copper foil in electronic circuits that hinder signal transmission, and these effects will be further amplified in high-speed PCBs. In response to this phenomenon, a low ferromagnetic metal barrier layer has been developed, which to some extent reduces the loss during signal transmission
Based on customer needs, targeted development of silane coupling agent adaptation technology has improved the chemical bonding performance of copper foil with different types of high-frequency high-speed resin substrates.